EDIsecure^® ILM-LS and ILM-DS Inline Lamination Modules

Fastest and most flexible lamination program for demanding applications

The ILM-LS and ILM-DS are easily connected to an XID 8300 via a small connecting bracket that is included with each ILM unit. These laminators communicate to the XID 8300 printer via a built-in infrared communication port, so no separate communication cable is required to manage the units from the printer or a PC. Both the ILM-LS and ILM-DS feature feature an electronic security lock for locking the front door of the unit to protect the supplies inside the unit. The units also provide for adjustability of patch laminate placement in 4 directions. 

We have developed the most flexible and fastest lamination program on the market to respond to your growing requirements for durable and secure tamper-resistant cards. With applying EDIsecure^® clear and secure laminates on the card, which includes patches with chip cut-out, the surface will be protected against physical damage and the card life extended.

The ILM-LS can be joined easily for Inline Lamination with the EDIsecure^® XID 8300 Retransfer Printer, simply attach the unit with the appropriate joining plate to the printer – that’s it. Communicating via infrared interface, the lamination parameters for the various card materials are controlled by the printer driver.

The laminator is also disposable as ILM-DS for simultaneous dual side lamination. Equipped with two lamination cartridges and separate temperature control of the upper and lower heat roller, even different laminates can be applied to the card at the same time.