Increasing demand

The demand to protect personalized ID cards against all kinds of physical impacts and making them more secure, is increasing rapidly. The EDIsecure^® overlamination solutions are the result of continuous research and development activities in order to provide a very high level of card security and protection to our customers.

The request for a higher level of security is mostly generated from governmental projects such as drivers license programs, national ID programs etc.. But even access control solutions are more and more demanding an improved security level. An increasing number of applications require the combination of high security overlamination and surface protection.

Flexible and reliable solutions

The EDIsecure^® overlamination solutions are based on proven and successful technologies and provide high quality lamination results on PVC, PVH, ABS, 100% PET and even Polycarbonate card materials. Even pre-loaded chip cards (contact or contactless) can be laminated without effecting the chip. The proper settings (speed, temperature etc.) for the various card materials can be adjusted and controlled separate for each module and lamination material. The lamination modules are communicating to the attached EDIsecure^® XID printer module and guarantee a smooth operation.

In combination with the optional automatic card feeder, the EDIsecure^® overlamination solutions are prepared for offline operation.

Investment protection

The EDIsecure^® lamination program is part of the EDIsecure^® re-transfer ID printer solution offering. The modular concept of dedicated printer and lamination devices provides the maximum of flexibility and availability. At any time it is possible to upgrade the configuration by just replacing or adding modules. Even attractive entry level solutions can be upgraded to high-end configurations.

For specific information, please contact our specialists. They are more than happy to find the best overlamination solution for your specific requirement.

Overlamination Options

single sided OVD or patches

single sided OVD and patches

double sided OVD or patches

double sided OVD and patches (sandwich)

Overlamination Materials

A wide range of different overlamination materials are available. The attractive portfolio covers all possible options to increase the level of card security and protection against physical impacts. All EDIsecure^® lamination materials are tested and certified for the use with EDIsecure^® consumables such as XID re-transfer films and color ribbons.

The 0.25 mils (0.00635 mm) thick materials are mainly designed for covering the security aspect with 2D or even 3D holographic patterns, even in combination with other security features. Applied edgeless to the card surface, it is not possible to separate the laminate from the card body.

The 0.6 mils (0.01524 mm) and 1.0 mils (0.0254 mm) thick patch materials are available to protect the card against heavy physical impacts. Due to the physical limitations patch laminates are a little smaller than the card body. Therefore a small unlaminated frame will appear. Most of the patch laminates are just a transparent layer, but the EDIsecure^® program provides the option to have any graphic design in the patch foil.